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UCON Solder Assist Fluids 25
Water-soluble UCON fluids are well-suited as base fluids for many applications in the electronics industry, including solder assist fluids. Excellent thermal and oxidative stability make them ideal for formulations used in printed circuit board manufacturing and assembly. Inhibited fluids provide high-temperature stability, high flash and fire points, and low foaming tendencies.
Select a product below to download a Technical Data Sheet. The table below lists the typical viscosity to help you select which product will meet your needs.
Process Fluids |
Description |
Viscosity 40¡ãC |
UCON Solder Assist Fluid 10 |
High flash point, water soluble, PAG based fluid with good inherent thermal stability and good water washability. Suitable as component in solder reflow fluids, fluxes and fusing fluids. |
280 |
UCON Solder Assist Fluid 24 |
Medium viscosity, PAG, excellent thermal stability and water washability. Suitable as component in solder reflow fluids, fluxes and fusing fluids. |
123 |
UCON Solder Assist Fluid 25 |
Low viscosity, water soluble PAG, good thermal stability and water washability. Suitable as component in solder reflow fluids, fluxes and fusing fluids. |
90 |
UCON Solder Assist Fluid 26 |
Low viscosity, water soluble PAG, additive improves stability at high temperatures and raises its flash point. Suitable as component in solder reflow fluids, fluxes and fusing fluids. |
90 |
Typical properties, not to be construed as specifications.
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